ASSEMBLER, SEMICONDUCTOR

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  1 - 2 Yr      Cleanroom Assembly Technician, Die Attach Operator, Semiconductor Assembler, Wafer Fabrication Technician, Wire Bonding Technician      Aerospace and defense, Computer & Consumer Electronics, Medical Equipment Manufacturing, Semiconductor & Electronic Component Manufacturing, Telecommunications      Cleanroom Operations, Engineering support, Manufacturing & Fabrication, Packaging & Testing   
Skills: Attention to Detail, Blueprint & Schematic Reading, Microscopic Assembly, Soldering & Circuit Integration, Wire Bonding & Die Attachment    Posted 3 months ago
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Job Description:

    • 1) Assembles microelectronic semiconductor devices, components, and subassemblies according to drawings and specifications, using microscope, bonding machines, and handtools, performing any combination of following duties: Reads work orders and studies assembly drawings to determine operation to be performed.
    • 2) Observes processed semiconductor wafer under scribing machine microscope and aligns scribing tool with markings on wafer.
    • 3) Adjusts scribing machine controls, according to work order specifications, and presses switch to start scribing.
    • 4) Removes scribed wafer and breaks wafer into dice, using probe.
    • 5) Places dice under microscope, visually examines dice for defects, according to procedures, and rejects defective dice.
    • 6) Positions mounting device on holder under bonding machine microscope, and adjusts bonding machine controls according to work order specifications.
    • 7) Positions die on mounting surface according to diagram.
    • 8) Presses switch on bonding machine to bond die to mounting surface.
    • 9) Places mounted die into holding fixture under microscope of lead bonding machine.
    • 10) Adjusts bonding machine controls according to work order specifications.
    • 11) Views die and moves controls to align and position bonding head for lead bonding according to diagram.
    • 12) Presses switch to bond lead and moves bonding head to points indicated in bonding diagram to attach and route leads as illustrated.
    • 13) Inserts and seals unprotected assembly into designated assembly container device, using welding machine and epoxy syringe, to protect microelectronic assembly and complete device, component, or subassembly package.
    • 14) Examines and tests assembly at various stages of production, using microscope, go-not-go test equipment, measuring instruments, pressure-vacuum tanks, and related devices, according to standard procedures, to detect nonstandard or defective assemblies.
    • 15) Rejects or routes nonstandard components for rework.
    • 16) Cleans parts and assemblies at various stages of production, using cleaning devices and equipment.
    • 17) Maintains records of production and defects.
    • 18) Bonds multiple dice to headers or other mounting devices.
  • 19) Important variations are kinds of equipment used, such as thermal compression, wedge, wire ball, and wobble bonders, items assembled, or procedure performed.
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